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dc.contributor.authorGoldberg, Edward D.  Concept link
dc.contributor.authorvon Herzen, Richard P.  Concept link
dc.contributor.authorSclater, John G.  Concept link
dc.date.accessioned2018-02-16T19:13:03Z
dc.date.available2018-02-16T19:13:03Z
dc.date.issued1980-08
dc.identifier.urihttps://hdl.handle.net/1912/9592
dc.description.abstractThe reproducibility of thermal conductivity measurements on fused silica glass by various investigators using different techniques suggests its suitability as a standard for such measurements. Our laboratory measurements with the needle probe technique on chip samples of silica glass saturated with water gave a value of 3.287 ± 0.154 (S.D.) mcal/cm s °C (n = 21) at 25 °C, which is within about 1% of the previously determined values and the value given by the manufacturer for this material. The good agreement indicates that the flat-plate steady-state and needle probe transient methods give the same value for this material, and that the water-saturated chip technique is an accurate method to measure thermal conductivity of isotropic samples.en_US
dc.description.sponsorshipSupported by the National Science Foundation under Grant OCE 79-0944 8.en_US
dc.language.isoen_USen_US
dc.publisherWoods Hole Oceanographic Institutionen_US
dc.relation.ispartofseriesWHOI Technical Reportsen_US
dc.relation.ispartofseriesWHOI-80-34en_US
dc.subjectThermal analysisen_US
dc.subjectSilicaen_US
dc.titleThermal conductivity measurement of fused silica glassen_US
dc.typeTechnical Reporten_US
dc.identifier.doi10.1575/1912/9592


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